防焊显影不洁的原因分析及解决方法

显影不洁作为线路板防焊层发生的主要问题，对企业的生产效率和产品质量有着很大的影响。本文针对线路板出现的防焊显影不洁的问题，通过实际观察和检验，明确了造成显影不洁的主要原因：油墨自身性能不稳定、预烤温度过高、曝光能量过高、显影压力及温度异常。同时提出相关的解决方法来预防此类问题的发生。

关键词：显影不洁；防焊；曝光能量；显影压力；预防
Analyzing the reason and the solution of under developing unclean in the Welding
Abstract: The development of the coating is the main problem of the solder rest. It has a great impact on the company’s production efficiency and product quality. Aiming at the problem of developing unclean in resistance welding of PCB, it’s found that the main factor of under developing unclean ring are: the ink itself is unstable; pre bake temperature is too high、exposure energy is too high、development pressure and temperature is abnormal. This article will show some to prevent and solve this problem of the developing unclean .

Key words: Under developing unclean；The welding；Exposure energy；Develoment pressure；Prevent

*若需了解更多与协助请咨询↓→[电脑QQ][手机QQ]【数据协助】