无机填料对无硼载体淀粉胶性能

无机填料对无硼载体淀粉胶性能
摘  要

介绍了无硼载体淀粉胶粘剂的制备原理和制备工艺，着重论述了无机填料对无硼载体淀粉胶粘剂的粘度、初粘度、粘结强度、边压强度的影响。用不同重量的无机填料P、H、R、M、 E分别对无硼载体淀粉胶粘剂进行条件实验，通过对条件实验的分析和比较，确定了无机复合剂的组成是P、R、H。通过对P、R和H的配比实验，确定了无机复合剂的最佳配比和对淀粉的实际用量。实验结果表明，当无机复合剂配比P:R:H=4:1:3，对淀粉的用量8%（重量百分比），用该无机复合剂制备的无硼载体淀粉胶粘剂的粘度为38.2秒（国家标准30～50秒），初粘力（即破纸率）为99.5%；用该胶粘剂粘制瓦楞纸板，检测瓦楞纸板的粘结强度为2426N/m，边压强度为3718N/m，都超过了东莞海富纸品有限公司生产的同纸质瓦楞纸板的粘结强度(1800N/m)和边压强度(3500N/m)。该胶粘剂不凝胶，不分层，不沉底，用该胶粘剂粘制的瓦楞纸板不返潮、不发软、挺度大。该胶粘剂用三氯化铁取代了长期使用的有毒交联剂硼砂是一种环保增强型淀粉胶粘剂。

关键词：淀粉胶粘剂，无机填料，瓦楞纸板，无硼
ABSTRACT

This paper describes the preparation mechanism and technique for the preparation of boron-free starch adhesive with carrier. Our research focuses on the impact of inorganic packing materials on the viscosity, early viscosity, water resistance, bond strength and compressive strength of boron free and support-free starch adhesive. The condition experiments were carried out using different amount of inorganic packing materials P, H, R, M and E to study their effects on the boron-free starch adhesive with carrier. After analyzing the results, the best ratio of P: R: H in the composite packing material is 4:1:3, and the actual amount used is 8% (weight percent of starch). The viscosity of as-prepared starch adhesive with the optimized experimental conditions is 38.2 seconds. Its initially stick force (broken paper rate) is 99.5%. The corrugated cardboards made with this adhesive have bond strength of 2426N/m, compressive strength of 3718N/m. The corrugated boards made by the Haifu Paper Packaging Ltd have adhesive bond strength of 1800N/m and compressive strength of 3500N/m. Thus, the corrugated boards have better quality than those produced by Haifu Paper Packaging Ltd. All test results indicated that the performance of the corrugated boards made with our adhesive has surpassed the national standard. This adhesive has stable performance. The corrugated board made with this adhesive dries very quickly, has good water resistant performance, and is very suitable for industrial production of adhesive.

Keywords: Starch adhesive, Inorganic packing material, Corrugated board, Boron-free

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